Sources from the supply chain reported that next flagship Xiaomi — Mi 9 — will be released in the first half of 2019 and is equipped with a Snapdragon chipset 8150.
Snapdragon 8150 is renamed the Snapdragon platform 855, which will be manufactured by TSMC using a 7-nm process technology with a separate chip for processing neural computing.
The main camera will consist of a 48-megapixel sensor Sony IMX586, and the RAM is 6 or 8 GB. It is expected the use of a fingerprint scanner below the display, support wireless charging and the ingress protection of the enclosure.
The previous flagship, the Xiaomi Mi line 8 consists of the main flagship, 8 Mi SE Mi 8 Fingerprint Screen Edition, Explorer Mi 8 Mi 8 Edition and Youth Edition.